ISSN print edition: 0366-6352 ISSN electronic edition: 1336-9075 Registr. No.: MK SR 9/7 Published monthly

 Kinetics of formation of diffusion layer at the electrolytic deposition of aluminium on copper base from molten electrolyte

P. Fellner and M. Chrenková-Paučírová

Institute of Inorganic Chemistry, Slovak Academy of Sciences, 842 36 Bratislava

Abstract: Formation of diffusion layers in the system Cu-Al was investigated in the temp. range 200-400°. Temp. dependence of kinetics of formation of the diffusion layer can be formally described by interdiffusion coeff. D = 0.17 exp (-15,600 K/T). When the layer of alloy at the Cu-Al interphase is thinner than ca.3 μm, then its growth is faster than it corresponds to a process governed by diffusion.

Full paper in Portable Document Format: 363a321.pdf

Chemical Papers 36 (3) 321–325 (1982)